3D profiling accelerated through dedicated on-board processing and frame-burst image acquisition mode

The Matrox Radient eV-CXP for 3D Profiling is the first Radient frame grabber to feature on-board 3D profiling.
MONTREAL – September 21, 2016 — Matrox® Imaging today announced the Matrox Radient eV-CXP for 3D Profiling, the first member of the Radient eV-Series of frame grabbers to feature on-board 3D profiling using patented Matrox technology. Offering the flexibility to work with any cameras using the CoaXPress® interface standard, this PCI Express frame grabber performs the laser line extraction needed for 3D profiling on the card itself, reducing system demand and freeing resources to be used toward the inspection tasks at hand.
Capable of extracting 9,000 profiles per second (from an image size of 2048x128 pixels)1 with no host CPU usage, the Radient eV-CXP for 3D profiling is ideal for use in inspection tasks in PCB production, road and rail maintenance, and both perishable and non perishable food analysis for example.